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Everything about Interposer
Layer between an integrated circuit and a printed circuit board
An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Wikipedia →
🧭 Start here: a 6-step reading path
- Read the overview: InterposerA 5-minute orientation
- Skim a recent paper: Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon InterposerInfluential work since 2022
- Pick up a classic book: Pindari CarminaThe most-reprinted book on the subject
- Read the landmark paper: Ultra-compact 32 × 32 strictly-non-blocking Si-wire optical switch with fan-out LGA interposerCited 185 times
- Go sideways: 2.5D integrated circuitA closely related topic
- Go sideways: Three-dimensional integrated circuitA closely related topic
📖 Definitions
Noun One who interposes.
Noun An electrical interface between one connection or socket and another, used to spread a connection to a wider pitch or to reroute it.
🗂️ The subject at a glance
No outline available.
🏆 Landmark papers (most cited)
Ultra-compact 32 × 32 strictly-non-blocking Si-wire optical switch with fan-out LGA interposer
Heterogeneous 2.5D integration on through silicon interposer
A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
Interposer Technologies for High-Performance Applications
Deep Reinforcement Learning-Based Optimal Decoupling Capacitor Design Method for Silicon Interposer-Based 2.5-D/3-D ICs
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface
🆕 Influential since 2022
Beyond CPO: A Motivation and Approach for Bringing Optics Onto the Silicon Interposer
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer
Numerical Analysis and Optimization of Chip-Level Drop Impact Reliability for Chiplet Based on Si Interposer
Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
📚 Books worth reading
Pindari CarminaPindar · 1798
Design and Modeling for 3D ICs and InterposersMadhavan Swaminathan · 2013- 📕EpistolaePseudo-Phalaris, Johannes Daniël van Lennep · 1718
Testing of Interposer-Based 2.5D Integrated CircuitsRan Wang, Krishnendu Chakrabarty · 2017- 📕TSV 3D RF IntegrationShenglin Ma, Yufeng Jin · 2022
- 📕The blackness of sins against light, or, Mens offering violence to their knowledge, and forcibly breaking thorow all the interposing flames of it, to work iniquityJohn Danforth · 1710
- 📕InterposedNew Media Junior · 2016
- 📕Par téléphone interposéDominique San Non. · 1978
Ranked by number of editions on Open Library, a rough measure of how lasting a book is.
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