Everything about Advanced packaging
Aims to overcome limitations of semiconductors
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging, where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities, unlike traditional integrated circuit packaging, which does not. Advanced packaging thus sits between fabrication and traditional packaging-or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D and 3D ICs are also called 2.5D or 3D packages. Wikipedia →
🧭 Start here: a 6-step reading path
- Read the overview: Advanced packagingA 5-minute orientation
- Skim a recent paper: Recent Advances and Trends in Advanced PackagingInfluential work since 2022
- Pick up a classic book: Interview with Syed Babar Ali, interviewed by Tarun Khanna, Boston, MassachusettsThe most-reprinted book on the subject
- Read the landmark paper: Challenges and prospects for advanced packagingCited 153 times
- Go sideways: 2.5D integrated circuitA closely related topic
- Go sideways: Glossary of microelectronics manufacturing termsA closely related topic
📖 Definitions
No dictionary entry for this exact phrase.
🗂️ The subject at a glance
No outline available.
🏆 Landmark papers (most cited)
Challenges and prospects for advanced packaging
Advanced Packaging: The Redistributed Chip Package
Advanced IC packaging for the future applications
Current Advances and Outlook of Advanced Packaging
Advanced polymer nanocomposites in packaging applications
Advanced Numerical Analysis of Transport Packaging
Glass Substrates for Advanced Packaging
Advanced Packaging Solution to Hermetically Packaging Microelectronic Devices
🆕 Influential since 2022
Recent Advances and Trends in Advanced Packaging
Chitosan for food packaging: Recent advances in active and intelligent films
Electroplated Copper Additives for Advanced Packaging: A Review
Advanced packaging of chiplets for future computing needs
Factors responsible for spoilage, drawbacks of conventional packaging, and advanced packaging systems for tomatoes
📚 Books worth reading
- 📕Interview with Syed Babar Ali, interviewed by Tarun Khanna, Boston, MassachusettsSyed Babar Ali, Tarun Khanna · 2016
Ranked by number of editions on Open Library, a rough measure of how lasting a book is.
🔗 Related topics
- 2.5D integrated circuit A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking…
- Glossary of microelectronics manufacturing terms Glossary of microelectronics manufacturing terms This is a list of terms used in the manufacture of electronic micro-components. Many of the terms are…
- Interposer An interposer is an electrical interface routing between one socket or connection and another. The purpose of an interposer is to spread a connection to…
- Three-dimensional integrated circuit A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more…
- System in a package In computer engineering, a system in a package or system in package (SiP) is a type of semiconductor packaging where multiple integrated circuits (ICs)…
- Fan-out wafer-level packaging Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit…
- Semiconductor device fabrication Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors…
- Integrated circuit An integrated circuit (IC), also known as a microchip or simply chip, is a compact assembly of electronic circuits formed from various electronic components…