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Everything about Ball grid array
Surface-mount packaging that uses an array of solder balls
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Wikipedia →
🧭 Start here: a 6-step reading path
- Read the overview: Ball grid arrayA 5-minute orientation
- Skim a recent paper: Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder BallsInfluential work since 2022
- Pick up a classic book: Area Array Packaging HandbookThe most-reprinted book on the subject
- Read the landmark paper: A Ball Grid Array Package With a Microstrip Grid Array Antenna for a Single-Chip 60-GHz ReceiverCited 76 times
- Go sideways: Flip chipA closely related topic
- Go sideways: Rework (electronics)A closely related topic
📖 Definitions
Noun A type of surface mount used to connect integrated circuits to printed circuit boards.
🗂️ The subject at a glance
🏆 Landmark papers (most cited)
A Ball Grid Array Package With a Microstrip Grid Array Antenna for a Single-Chip 60-GHz Receiver
Ball-grid array architecture for microfabricated ion traps
Integrated Circuit Ceramic Ball Grid Array Package Antenna
Solder joint reliability of plastic ball grid array packages
Analysis of a thermally enhanced ball grid array package
Integration of microstrip patch antenna on ceramic ball grid array package
Plasma cleaning of plastic ball grid array package
Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications
🆕 Influential since 2022
Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls
3D CT scan metrology for solder void formation analysis in ball grid array electronic chips
Effect of flip-chip ball grid array structure on capillary underfill flow
Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging
📚 Books worth reading
Area Array Packaging HandbookKen Gilleo · 2001
Area Array Packaging MaterialsKen Gilleo · 2003
Twenty second IEEE/CPMT International Electronics Manufacturing Technology SymposiumIEEE/CPMT International Electronics Manufacturing Technology Symposium (22nd 1998 Berlin, Germany), Institute of Electrical and Electronics Engineers · 1998- 📕ITherm 2002InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego, Calif.) · 2001
Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology SymposiumIEEE/CPMT International Electronics Manufacturing Technology Symposium (26th 2000 Santa Clara, California), Institute of Electrical and Electronics Engineers · 2000
Twenty third IEEE/CPMT International Electronics Manufacturing Technology SymposiumIEEE/CPMT International Electronics Manufacturing Technology Symposium (23rd 1998 Austin, Tex.), Institute of Electrical and Electronics Engineers · 1998
Ball Grid Array TechnologyJohn H. Lau · 1995- 📕An investigation into ball grid array inspection techniques · 1999
Ranked by number of editions on Open Library, a rough measure of how lasting a book is.
🔗 Related topics
- Flip chip Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices…
- Rework (electronics) In electronics, rework (or re-work) is repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of…
- Solder ball In integrated circuit packaging, a solder ball, also known as a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides…
- Pin grid array A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular…
- List of electronic component packaging types Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards…
- Integrated circuit packaging Integrated circuit packaging is the final stage of semiconductor device fabrication, in which a die is encapsulated in a case that prevents physical damage…
- Land grid array The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a…
- Flat no-leads package Flat no-leads packages such as quad-flat no-leads (QFN)[1] and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed…