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Everything about Flip-Chip module
Historical electronic computer module design
A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation (DEC) for its PDP-7, PDP-8, PDP-9, and PDP-10 computers, and related peripherals, beginning on August 24, 1964. Wikipedia →
🧭 Start here: a 6-step reading path
- Read the overview: Flip-Chip moduleA 5-minute orientation
- Skim a recent paper: Improvement Heat Dissipation of Flip Chip Double-Sided Cooling IGBT Module Using AlSiC-Interposer TechnologyInfluential work since 2022
- Pick up a classic book: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesThe most-reprinted book on the subject
- Read the landmark paper: 214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser ModuleCited 62 times
- Go sideways: DEC System ModuleA closely related topic
- Go sideways: Standard Modular SystemA closely related topic
📖 Definitions
No dictionary entry for this exact phrase.
🗂️ The subject at a glance
🏆 Landmark papers (most cited)
214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser Module
Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging
Thermal transient measurement and modelling of a power cycled flip-chip LED module
A novel multichip module assembly approach using gold ball flip-chip bonding
Parameter driven monitoring for a flip-chip LED module under power cycling condition
Thin Optical Head with Flip-Chip Bonded Module for Compact Disc Read Only Memory Drives
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
High-lead flip chip bump cracking on the thin organic substrate in a module package
🆕 Influential since 2022
Improvement Heat Dissipation of Flip Chip Double-Sided Cooling IGBT Module Using AlSiC-Interposer Technology
Golden Bump Based Flip-Chip Interconnection for Superconducting Multi-Chip Module
High-Speed Photodetector Module With Bandwidth Over 100 GHz Based on Flip-Chip Bonding Scheme
An Interconnection Verification Method and a New Substrate Option for Cu Pillar Flip-chip Module Applications
Development of a novel low-mass module flex PCB using nano-wire-based flip-chip interconnection
📚 Books worth reading
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesJohn H. Lau · 2000- 📕FCIP and expanding markets for flip chipThomas W. Goodman · 1997
Flip chip technologiesJohn H. Lau · 1996
Ranked by number of editions on Open Library, a rough measure of how lasting a book is.
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